Final Draft International Standard
ISO/PRF 9455-18
Soft soldering fluxes — Test methods — Part 18: Cleanliness of soldered printed circuit assemblies before and/or after cleaning
Reference number
ISO/PRF 9455-18
Edition 1
2024-08
© ISO 2024
Final Draft
International Standard
Under development (Edition 1, 2024)
This draft is in the approval phase.

Abstract

This part of ISO 9455 specifies test methods of cleanliness of the Soldered Printed Circuit Assemblies before and/or after cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.

General information

  • Status
     : Under development
    Publication date
     : 2024-08
    Stage
    : Proof sent to secretariat or FDIS ballot initiated: 8 weeks [50.20]
  • Edition
     : 1
    Number of pages
     : 12
  • Technical Committee :
    ISO/TC 44/SC 12
    ICS :
    25.160.50 
  • RSS updates

Life cycle

Sustainable Development Goals

This standard contributes to the following Sustainable Development Goal

9
Industry, Innovation and Infrastructure

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